Mattson Technology Inc, a leading supplier of advanced process equipment used to manufacture semiconductors, has announced that it has shipped the Helios XP rapid thermal processing (RTP) system to a leading chipmaker. The qualification system will be used for the manufacturing and development of advanced logic devices. Production revenues are expected to begin in 2011.

“The selection of the Helios XP demonstrates that our investments to extend our RTP portfolio into the logic and foundry markets are paying off and further reinforces Mattson Technology’s progress in gaining share in these new markets,” said Andreas Toennis, senior vice president and general manager of Mattson Technology’s Thermal Products Group. “This leading chipmaker selected the Helios XP for its logic fab based on the proven reliability, high productivity, and superior process control that the tool demonstrated at its memory facilities.”

Toennis continued, “The Helios XP’s state-of-the-art temperature measurement and control system enables a broad temperature range that gives logic device makers the ability to cover the full array of advanced RTP applications, and its patented HotShield design produces repeatable within-wafer and wafer-to-wafer uniformity, eliminating pattern shift effects and enabling excellent process yields.”